HJS 

HJS production and manufacturing base was established in Shenzhen. As sub BU of HJS group, this company’s main business is high-precision die bonder, die sorter and related customized equipment in the optical communication and semiconductor industry.

Our equipment includs but not limited to:

• Die Bonding Machine, Die Attach Machine, Wire Bonding Machine
• Flip Chip Bonding Machine
• Eutectic Bonding Machine
• Other Customized Solutions

The company is committed to the concept of high-tech, high-quality, win-win, and stable performance in the development of the semiconductor equipment industry. The comprehensive application of multi axis linkage technology and visual technology has reached international advanced levels.